Recently, the American fabless semiconductor manufacturing behemoth AMD unveiled its Ryzen 7000 line of processors. These next CPUs will mark the first significant revision to Ryzen's processor portfolio since its debut in 2017. The Zen 4 architecture and AM5 socket are both brand-new to the Ryzen 7000 CPUs. Along with supporting DDR5 system memory, PCIe Gen 5 graphics cards, and storage options, these processors will expand Team Red's product line. 

AMD said that the new CPUs would have up to 13% improvements in IPC at the announcement event on August 29 in Austin, Texas (Instructions Per Cycle). The business provided media representatives with demo Ryzen CPU chips so they could see the chips inside workings at the same event. With Zen 4, Team Red has introduced some swanky advancements to accomplish their desired performance enhancements. The 13% increase in IPC and up to 60% increase in gaming performance over the Core i9 12900K are the result of various internal adjustments. 

Here are the top 5 features of the Ryzen 7000 range, the largest breakthrough in AMD CPUs since 2017. 

1) A Zen 4 architecture  

The underlying Zen 4 architecture is the most significant factor influencing the improved performance levels of the upcoming Ryzen 7000 CPUs. AMD has switched to a 5nm process node for the first time. The future Ryzen-based computers should run better, have reduced latencies, and be more efficient as a result. 

AMD significantly expanded the L2 and L3 cache with Zen 4. Cache memory on Ryzen processors may now hold up to 80 MB, greatly enhancing performance. Additionally, Zen 4 CPUs have been tuned to operate at high clock rates of 5 GHz and higher. The top-tier Ryzen 9 7950X clocks at at up to 5.7 GHz. As a result, the Zen 4 architecture is largely responsible for the increased performance of Ryzen 7000. 

2) Significantly reduced IO chiplet lithography 

The I/O die is located beneath the two gold-plated chiplets in the substrate shown in the top image. It is a sizable silver chiplet. In comparison to a Ryzen 7000 chip, the I/O die's overall design and exterior appearance have not changed. 

However, AMD has switched to a lithography that is far more effective for the I/O die in the next Ryzen family. The I/O die in Zen 3 processors uses 12nm technology. Zen 4 advances significantly by including an I/O device made using 6nm technology. The I/O die has a considerable impact on the chip's overall processing power even if it has no direct impact on the performance of the core complex dies (CCDs). 

3) Specialized Surface Mount Device installation (SMDs) 

CPUs of the Ryzen 7000 series include an eight-legged Integrated Heat Spreader, making them easy to recognize (IHS). But the IHS's spider-like appearance serves a purpose. The improved performance of the Ryzen 7000 CPUs was attained without enlarging the physical chip. This choice contrasts with Intel, who has increased chip sizes with each generation. 

Surface Mount Devices (SMDs) were relocated to the side of the chip by AMD in order to preserve a similar chip size. SMDs are located at the bottom of Intel chips. To prevent the chips from growing too big, Team Blue (Intel) had to considerably improve pin density in their most recent LGA 1200 and LGA 1700 designs. 

In comparison to AM4 chips, moving the SMDs above the chip produced a similar IHS surface area. Additionally, it makes it possible for coolers produced using one generation of sockets to work with the other. 

4) Three or more 5nm chiplets. 

Depending on the SKU, the future Ryzen 7000 processors can support up to three chiplets. The more expensive Ryzen 7 7700X, Ryzen 9 7900X, and Ryzen 9 7950X chips include one I/O die and two Core Complex Dies (CCDs). One CCD and one I/O die make up the midrange Ryzen 5 7600X. 

Individual cores and the CCXs are housed in CCDs. Integrated Memory Controller (IMC) and PCIe controller are the two primary components of the I/O die. The TSMC 5nm process node was used to create the CCD used in the forthcoming Ryzen processors. The I/O die was produced using the 6nm manufacturing node at Global Foundries. 

These chiplets are crucial in establishing the processor's total IPC. The 13% gain in performance is attributable to the incredibly advanced and effective technologies employed in their production. 

5) A new standard graphics processor based on RDNA 2 

With Ryzen 6000 "Rembrandt" mobile processors, AMD unveiled integrated graphics chips based on the RDNA 2 architecture. The embedded CPU on each Ryzen 7000 desktop chip will be a "standard" RDNA 2-based model. Four Compute Units are anticipated to be present in this iGP (CUs). They will only permit minimal workloads for video output, encoding, and decoding. However, AMD has included capability for decoding AV1 video in the processors' enhanced video acceleration features. 

Overall, the next Ryzen CPU lineup is looking like it will be an intriguing series. On September 27, the processors will make their debut on a worldwide scale. As the embargo on the future chips breaks, more information about how they compare to Ryzen 5000 and 12th Gen Alder Lake CPUs will become available. The X670 and X670E motherboards will go on sale at the same time. The B650 and B650E motherboards, which are affordable and cost-effective, won't be available to customers until October.